The MicroProf® FE from FRT is a standardized, 100% automatic 2D/3D wafer metrology tool. Owing to its fully SEMI conformal metrology solutions as well as virtually maintenance-free hardware parts, which enable high throughput, the MicroProf® FE is the ideal “workhorse” for every front-end lab.
The typical configuration can be improved by several optional functions; even on-site upgrades can be done at a later date. Users can cope well with the fast technological development at lower investment costs - with the MicroProf® FE.
Highlights of MicroProf® FE
- Multi-sensor technology, based on the MicroProf® 300
- 100% automatic 2D and 3D surface metrology for front-end applications
- Specific inline solution
- Equipment Front End Module (EFEM)
- Wafer Handling Module
TTV Option
The standalone systems as well as tabletop tool of the MicroProf® series have the option for two-sided sample review. This facilitates measurement of the bottom and top sides of the sample at the same time and also the determination of sample thickness. The sample’s total thickness variation (TTV) can be defined together with surface parameters, for example, the flatness, waviness, and roughness of both surfaces. The TTV option can be effortlessly retrofitted on-site.
Fully Automated 2D and 3D Surface Metrology