A study group headed by Professor Junsuk Rho from the Department of Mechanical Engineering and the Department of Chemical Engineering and Ph.D. candidates Dongwoo Lee, Jeonghoon Park, and Seokwoo Kim from the Department of Mechanical Engineering at Pohang University of Science and Technology (POSTECH) efficiently established bound states for the first time in the continuum via the use of an acoustoelastic coupling structure.
Scientists have created a novel framework for computer memory that could boost performance while also lowering the energy requirements of internet and communications technologies, which are expected to consume about a third of global electricity in the next 10 years.
As one of the industry’s foremost providers of Au-based products, Indium Corporation® will proudly feature its high-temperature and high-reliability gold solder solutions at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico, April 18-20.
Raman microscopy specialist WITec GmbH has introduced Suite SIX, the next stage in software for Raman and correlative measurement control, data acquisition and post-processing.
AMETEK Land, the world leader in high-accuracy, non-contact temperature measurement systems, has developed its portable flue gas analyser to aid combustion optimisation and gas testing in glass furnaces.
Researchers from the Disruptive & Sustainable Technologies for Agricultural Precision (DiSTAP) Interdisciplinary Research Group (IRG) of Singapore-MIT Alliance for Research and Technology (SMART), MIT’s research enterprise in Singapore, and their collaborators from Temasek Life Sciences Laboratory (TLL) and Massachusetts Institute of Technology (MIT), have developed the first-ever microneedle-based drug delivery technique for plants.
Engineers responsible for cloud-based industrial automation and safety systems will find the FieldServer™ Gateway Product Suite from MSA Safety now provides them with a flexible, proven EtherNet/IP™ driver solution that is certified by the Open DeviceNet Vendors Association (ODVA®).
For the second year in a row, CSEM is granting its Inventor Award to a patented technological innovation with a high impact on our business, the industry and society in general.
LMI Technologies (LMI), a leading developer of 3D scanning and inspection solutions, is pleased to announce the official release of its new Gocator® 2540/50 high-speed wide field of view 3D laser line profile sensors.
Students from the Lausanne University of Art and Design (ECAL) have teamed up with CSEM’s engineers to create an avant-garde iridescent jewelry collection.