Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity.
At the BondExpo fair in Stuttgart Panacol will present its new Structalit® 5604. It is an extremely fast-curing adhesive which is specifically developed for bonding SMDs to printed circuit boards.
Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications.
As a result of their collaboration, Bostik and Polytec PT are launching a new range of thermal conductive adhesives (TCA) to address the challenge of thermal management in the latest Cell-to-Pack (CTP) battery design for e-mobility solutions.
XlynX Materials, a specialty chemical and materials company based in Victoria, Canada, is proud to announce that it has been recognized as a recipient of the 2023 Innovation Award at this year’s Adhesion and Sealants Council (ASC) Convention and Exposition in New Orleans, Louisiana, April 18, 2023.
Master Bond EP5LTE-100 is a one part, non-premixed and frozen epoxy with a very low coefficient of thermal expansion (CTE), high glass transition temperature (Tg), and extremely high modulus.
How Robafoam and Henniker’s Cirrus atmospheric plasma system enhance foam sealing performance.
Atmospheric in-line plasma system installation at Robafoam. Image Credit: Henniker Plasma̴...
Master Bond EP17HTDA-2 is a one component epoxy that can be used for bonding, sealing and die attachment. It is not premixed and frozen, and cures with heat.
PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce that it has been awarded a new patent for optical bonding.